The principle, function, and characteristics of X-ray detection imaging system equipment
1、 Functions of X-ray detection imaging system equipment
The first thing to introduce is the measurement function, which can measure the distance between straight lines, circle diameter, concentric circles, and the distance between points and the center of a circle.
2. It also has CNC function, memory programming, automatic recording and detection of motion paths, accurate positioning, and convenient for small batch repeated detection.
3. The navigation and positioning functions are also very good. With the help of a large navigation window, clicking on any area of the tested image with the mouse can automatically and quickly locate the target detection point.
Finally, it also has image processing capabilities, supporting multiple image formats, real-time processing, and online storage of detected images.
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2、 Principles of X-ray inspection equipment
X-ray equipment uses high-pressure accelerated electrons to release X-rays, which penetrate the sample and leave an image. Technicians observe the relevant details of the sample through the brightness of the image. It can detect a series of abnormalities, such as PCB circuit disconnection, IC defects, and solder ball cracking.
Firstly, X-ray equipment mainly utilizes the penetration effect of X-rays. X-rays have short wavelengths and high energy. When they are irradiated on a substance, it can only absorb a small portion and most of the X-rays. The energy of a ray will pass through the gaps between material atoms, demonstrating strong penetration ability.
The X-ray equipment penetrates the sample to be tested by X-ray, and then maps the X-ray image onto the image detector. The quality of image formation mainly depends on resolution and contrast. Generally speaking, the X-ray tube of X-ray equipment also determines the function of X-ray equipment.
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2. X-ray equipment can detect the relationship between the penetration ability of X-rays and the density of substances, and the differential absorption characteristics can distinguish substances of different densities. Therefore, if the inspected object ruptures, the thickness, shape, and X-ray absorption rate will vary, resulting in different images. Therefore, different black and white images can be generated.
X-ray tubes mainly provide electrons from the hot cathode through an electric field to accelerate to the anode. When electrons rapidly accelerate to a high-speed state under high pressure of tens of kilovolts, kinetic energy is converted into the release of X-rays when they collide with the anode. The size of the collision area is the size of the X-ray source. Through the principle of small hole imaging, we can roughly know that the size of the X-ray source is inversely proportional to the clarity, that is, the smaller the X-ray source, the clearer the image.
3. X-ray detectors make up for the shortcomings of chemical film imaging in the past. Detectors can save costs while improving efficiency. It can be used for IGBT semiconductor inspection, BGA chip inspection, LED light strip inspection, PCB bare board inspection, lithium battery inspection, and non-destructive inspection of aluminum castings.
In short, it is achieved by using non-destructive microfocal X-ray equipment to output high-quality perspective images and then converting the signals received by the flat panel detector. All functions of the software can be completed with just the use of a mouse, making it very easy to use. Standard high-performance X-ray tubes can detect defects below 5 microns, and some X-ray devices can detect defects below 2.5 microns. The system magnification can reach 1000 times, and objects can move and tilt.
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III Application Fields of X-ray Testing Imaging System Equipment
1. Industrial X-ray testing equipment has a wide range of applications. Usually used in the battery industry, such as lithium battery testing, circuit board industry, semiconductor packaging, automotive industry, circuit board assembly (PCBA) industry, etc., to observe and measure the position and shape of internal objects in packaging, identify problems, confirm product conformity, and observe internal conditions.
2. Specific application scope: mainly used for SMT, LED, BGA, CSP flip chip inspection, semiconductor, packaging components, lithium battery industry, electronic components, automotive components, photovoltaic industry, aluminum die-casting, molded plastic, ceramic special inspection products and other industries.
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