X-ray flaw detection is a nondestructive testing method to find defects by using X-ray's ability to penetrate material and have attenuation in material.

The commonly used detection methods for BGA include visual inspection, flying needle electronic testing, X-ray detection, staining detection, and slice detection. Among them, X-ray detection utilizes the transmission characteristics of X-rays to effectively detect the welding situation of solder balls hidden under the device, and is currently the most effective BGA welding quality detection method.