With the continuous development of technology, chip testing has become an indispensable part of many industries. As an important tool for chip detection, X-ray detection equipment is increasingly receiving people's attention.

The commonly used detection methods for BGA include visual inspection, flying needle electronic testing, X-ray detection, staining detection, and slice detection. Among them, X-ray detection utilizes the transmission characteristics of X-rays to effectively detect the welding situation of solder balls hidden under the device, and is currently the most effective BGA welding quality detection method.